2023-32155 – Package Development BE M/F

Regular/Temporary : Regular
Position description :
Robust packaging of integrated circuits plays a key role in semiconductor manufacturing. Package R&D team mission is to develop the Lead Frame package platform, introduce new chip scale packages and ensure the associated Chip-Package Interaction (CPI), to support ST business growth and customer satisfaction by providing the perfect packaging solution.

With the aim of supporting the package innovation and maintaining our strong effort on quality, we are looking for a Chip Package Interaction (CPI) engineer to join the package R&D team. The role requires to identify and evaluate chip package interactions to ensure product robustness in reliability tests.

Silicon technologies and package evolutions raise more interaction between Front End (silicon die build) and Back End (package build) processes. Chip Package Interaction characterization allows to improve existing products and to anticipate possible risks during new package/process developments.

Main job responsibilities and tasks will be:
–       ensuring safe product development & ramp-up by validating in advance compatibility between Silicon and Package for all ST Groups
–       ensuring deployment of CPI methodology and good practice for future technologies and products
–       anticipating potential weaknesses during early development phases
–       to implement in production innovative material and or process in accordance with a given package / technology mission profile
–       to interface with other internal and external entities, program and product manager in case of new product introduction requiring CPI activities
–       to interact with BEM&T central functions and assembly Plants for industrialization and implementation of new technologies
–       to bring the assembly process through the maturity levels according to relevant SOPs

Education Level Required: Laurea,
Years of Work Experience: 0 to 10
Other skills required are: Degree on mechanics or material science DoE’s and statistical analysis tools, basic in CAD/FEM tools, manufacturing principles, good presentation skills; ability to interface with Customers and Assembly sites. Fluent in English; basic packaging know-how preferred. Available to intercontinental travel.
Education level required : 5 – Master degree
Language / Level :
English : 2- Business fluent
Language / Level :
Italian : 2- Business fluent
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