Regular/Temporary : Temporary
Position description :
WHY JOIN US
At ST, we are more than 50,000 creators and manufacturers of microelectronic technologies.
We work with more than 200,000 customers and thousands of partners. Together with them, we design and create products and solutions that address their challenges and the need to contribute to a more sustainable world. Our cutting-edge technologies enable smarter mobility, more efficient energy management, power management and large-scale deployment of the Internet of Things (IoT) and 5G.
ST has received the Top Employer France and HappyTrainees 2023 certifications. They recognize us as a benchmark employer and demonstrate our commitment to making people a priority.
OUR FUTURE COLLABORATION
STMicroelectronics Imaging Division is specialized in the development, production and commercialization of imager Integrated Circuits. The projects industrialization is located in Grenoble and Taiwan Hsinchu sites, involving subcontracting partners. A VIE position is opened to support quality and reliability team in Taiwan and contribute to the industrialization and follow up of new electronic components. During the 2 years mission, the VIE will work autonomously on below missions:
Execution of reliability trials follow-up (Program Management) including:Respect of defined planning / no deviation or excursion
Cycle time of each step (including assembly, test, reliability trials)
Consolidation of test results and drift analysis (Data Mining will be needed),
Weekly reporting of results to Reliability and Quality team,
Reporting to management of issues & identified risks,
Coordination, analysis and follow up of Failure Analysis activities with involved laboratories (ST Europe, Asia & sub-contracting partners). FACA reporting to Reliability and Quality team,
Support to reliability Hardware & Software validation activity (reliability boards, …), import of new recipes in reliability ovens, monitoring of ongoing trials,
Regular visit to suppliers and review of results, KPIs & procedures (trials, ESD protection, …).
Autonomy and willingness to work in a remote location, good communication, eagerness to adapt to a new culture and learn mandarin basics, team spirit, curiosity, flexibility, reactivity, priority management.
Quality problem solving methods (8D, ishikawa), reliability knowledge (theoretical & practical), knowledge of techniques and process of Failure Analysis and knowledge of electronics/microelectronics are requirements for this position.
YOUR PLACE OF WORK
Education level required : 5 – Master degree
Language / Level :
English : 2- Business fluent
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