2023-32041 – Package Development BE M/F

Regular/Temporary : Regular
Position description :
1.     Ensure the fulfillment of product requirement s including all items for product release. Identify deliverable s and ensure deliverable completion to ensure successful product transition to the Operations team.
2.     Forecast, plan, coordinate design, package qualification, test, characterization and reliability testing to ensure new product qualification schedule timeliness.
3.     Work closely with BU to define product release timelines and strategies.
4.     Document, summarize and report on project status to key stakeholders, communicating progress to schedule and highlighting schedule and project risks.
5.     Ensure all testing, reliability stress and evaluation is completed in accordance with current and emerging standards and specifications including JEDEC, AEC-Q101, Power Module LV3 24 , AGQ324 and related standards .
6.     Facilitate DFMEA and DVP&R, ensuring products are effectively identified and documented. Ensure previous lessons learned are incorporated into new product risk analysis.
7.     Utilize 8D methodology to ensure Qualification issues are effectively addressed and documented to ensure effective corrective actions and to ensure Lessons Learned are captured for future product development.
8.     Support or lead NPI system level improvements to ensure efficient product definition, approval and release in support of APQP requirements.

1.     Master or above degree in electrical/ mechanical/material engineering
2.     Strong understanding of semiconductor device fabrication and assembly technology, also with knowledge in semiconductor device physics, preferably SiC, GaN, IGBT, MOSFET, FRD,SCR…
3.     Experience in package design/simulation/implementation.
4.     Advanced knowledge of elasticity, plasticity, failure, and heat transfer in materials/structures.
5.     Advanced knowledge of materials properties and associated analytical models used in mechanical engineering problem solving.
6.     Knowledge of JEDEC, IEC, IPC and AEC standards are desired.
8.     Experience in geometric dimensioning and tolerancing, good at tolerance stack-up analysis based on the component and process tolerances.
9.     Must possess knowledge of manufacturing technologies and production variance
10.  Have experience with simple and complex manufacturing processes including transfer molding, stamping, forming, casting, final assembly
Regular
Education level required : 4 – Bachelor degree
Language / Level :
English : 2- Business fluent
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