2023-30924 – Package Development BE M/F

  • CDI
  • N’importe où
  • Publié il y a 8 mois

Regular/Temporary : Regular
Position description :
To join STMicroelectronics Back End Package Development R&D teams, focusing on Wafer Level Chip Scale Package (WLCSP) packaging.

1. As part of WLCSP package development team with focusing role of technical project manager on New Product Introduction; ensure NPI package development project adherence to timeline and achieve all major milestone target.

2. Working with various cross functional organization such as internal team, NPI and OSAT partners to bring product from development to volume production and ensuring proper hand over,

3. Define standard process and deploy in production; Implement Best known method and lesson learnt during project execution.

4. Support operation team in problem of highly technical and complex manufacturing issue.

Bachelor’s Degree in Engineering
At least 4 years of working experience in WLCSP assembly, with prior experience in WLCSP back-end assembly process (bumping and DPS).
Experience in package R&D activity.
Have experience in semiconductor industry tools such as FMEA, 8D, SPC, OCAP.
Experience in working with multiple organization.
Prior project management role in the semiconductor BE industry is a plus.
Total Quality mindset.
Education level required : 4 – Bachelor degree
Language / Level :
English : 2- Business fluent
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