2022-24355 – Process Technology Development M/F

  • CDI
  • N’importe où
  • Publié il y a 1 mois

Regular/Temporary : Regular
Position description :
Performs specific activities for the the development and validation of new process bricks in Die Attach for IC semiconductor packages (QFN /BGA /LGA)  by establishing robust process setting, materials and equipment capability to enable successful development and timely  release of new products to mass production

KNOWLEDGE and SKILLS (minimum)
 – Programming, Operate and Basic troubleshooting of Advanced Die Attach Brands/Model (ESEC  /ASM )  
 –  specify  basic tool and fixtures design. –
–  Understands  DA material properties
– Can perform  New Die Attach process brick Optimization thru DOE
 -Can analyze data using statistics and interpret  into engg information and solution recommendation 
– perform problem solving by using Quality Tools  (QC Story / DMAIC / 8D / Error Proofing)
– Can  generate Technical Reports
– can participate into technical meeting with other local and international counterparts other assy sites in the company
– Posses basic leadership skills  to lead technicians and other counterparts in the company towards project / activity undertakings.
Education level required : 4 – Bachelor degree
Language / Level :
English : 2- Business fluent
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