Regular/Temporary : Regular
Position description :
Within the Microcontroller & Digital IC Group Central technologies R&D team, the mission is to support the development of the technology roadmap. It covers eNVM roadmap for General Purpose (MCD) & Secure MCUs (SMD) Divisions , standalone EEPROM for the Memory Division (MMY).
In this role, convergence with the Divisions technical staff must be reached and requires a strong collaboration based on a deep Silicon technologies know-how and a good understanding of the product needs.
The Goal is to follow execution & bring relevant added value at Group level for the technology programs defined by MCD,SMD & MMY, establishing strong link with Technology & Development Platforms Organization (TDP), ST Manufacturing sites (mainly Crolles & Rousset), MDG Central Operation & Central Quality.
Support from definition to full maturity in mass production (yield at WWS/robust process) the eNVM technology roadmap executed by TDP, and driven by MMS, bringing competitive advantages trough best in class performances, cost efficiency & full compliancy with ST Quality Standards & Operating Procedures.
Benchmark ST technologies with main competitors & Foundries .
Help to select when appropriate the Foundry technologies if needed, with the support of ST Wafer Foundry Outsourcing (WFO) organization.
Get involved in eNVM technology transfer programs for 2nd source requirement.
Help TDP to set-up the adequate resource & allocated budget for technology road-map execution.
A Deep expertise in Silicon technology & Device engineering is required to bring relevant contributions in all fields mentioned above.
Fluent English, excellent communications skills, good understanding of product test/qualification/reliability, and eNVM know-how are needed on top of a strong motivation to bring to ST a Worldwide technology leadership. Traveling to various ST sites & Foundries is also expected.
Education level required : 5 – Master degree
Language / Level :
English : 2- Business fluent