2021-15610 – Package Development BE M/F

  • CDI
  • N'importe où
  • Publié il y a 1 mois

Regular/Temporary : Regular
Position description :

To support ST division in new product development, package development and product Transfers of wire bonding process by deploying from R&D to defined ST BE sitesPerforming initial assessment trials by defining reference parameters as per target requirements
Generate DOE matrix and perform statistical analysis to achieve more robust parameters
Verification of quality checks by SPC, chemical etching, cross section and inter-metallic coverage inspection
Perform reliability steps and analyze test failures of qualification lots and provides corrective action
To lead and manage WB technical community
To support BEM&T plants in any wire bonding related issues. With continuous assessment of all WB related ECC
       1. Actively reviewing ECC WB related with WB TC
Research on wire bonding advanced solutions with suppliers of capillary, wires, and equipment and sensors
Methodology development for optimization

High technical expertise in wire bonding
Good communication skills
Statistical basics
Data management basics
Flexibility to travel 
Good in following multiple activities/projects in parallel
Basics projects management skills
Education level required : 4 – Bachelor degree

 
 
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