Regular/Temporary : Regular
Position description :
The Candidate will perform analysis of semiconductor devices to determine the failure mechanism and root cause.
Devices supported include automotive audio devices, mobile phone/tablet MEMs and a variety of devices in other products.The failure analysis activities include sample preparation, electrical verification, fault isolation, physical analysis.The Candidate will use analysis tools including X-Ray, acoustic and optical microscopes, SEM, FIB, LASER scanning microscope (OBIRCH, EMMI), RIE (Reactive Ion Etching), mechanical polishers, CAD layout/schematic tools, laser and chemical decapsulators, chemical hoods, etc. The candidate will also have the responsibility of administrating some Failure Analysis tools, generate internal analysis reports which will include results of working with process to understand how the failure mechanism relates to the failing symptoms.
The Candidate must be able to:
-Perform with a persistent attention to detail and possess a high level of comfort in working with investigative nature of activities
-Read semiconductor CAD layout and understand how the layout corresponds to the schematics
-Collaborate with failure analysts and managers
-Perform analysis and produce technical reports
-Interface with internal customers with good communication skills
-Perform analysis with Scanning Electron Microscope and Focused Ion Beam systems
-Demonstrate proficient computer skills, especially Excel, Word and PowerPoint
-Work well in a team environment
Education level required : 4 – Bachelor degree
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